Technology Trade Show

The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto via Getty Images)
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025. (Photo by Joan Cros/NurPhoto via Getty Images)
Technology Trade Show
PURCHASE A LICENSE
How can I use this image?
$375.00
USD
Getty ImagesTechnology Trade Show, News PhotoTechnology Trade Show, News PhotoTechnology Trade Show Get premium, high resolution news photos at Getty ImagesProduct #:2215791142
$499$175
Getty Images
In stock

DETAILS

Restrictions:
Contact your local office for all commercial or promotional uses.
Credit:
NurPhoto / Contributor
Editorial #:
2215791142
Collection:
NurPhoto
Date created:
March 05, 2025
Upload date:
License type:
Rights-managed
Release info:
Not released. More information
Source:
NurPhoto
Object name:
cros-notitle250305_nplWE
Max file size:
3066 x 2044 px (10.22 x 6.81 in) - 300 dpi - 2 MB